? semiconductor components industries, llc, 2012 january, 2012 ? rev. 8 1 publication order number: mur550/d mur550apfg, MURD550PFG, mur550pfg, murf550pfg, nrvud550pft4g switchmode power rectifier these state ? of ? the ? art devices are designed for power factor correction in discontinuous and critical conduction mode. features ? 520 v rating meets 80% derating requirements of major oems ? low forward voltage drop ? low leakage ? ultrafast 95 nanosecond recovery time ? reduces forward conduction loss ? aec ? q101 qualified and ppap capable ? nrvud prefix for automotive and other applications requiring unique site and control change requirements ? all packages are pb ? free* applications ? dcm pfc designs ? switching power supplies ? power inverters mechanical characteristics: ? case: epoxy, molded ? epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: mur550apfg: 1.1 gram (approximately) MURD550PFG, nrvud550pft4g: 0.4 gram (approximately) mur550pfg, murf550pfg: 1.9 gram (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 ? c max. for 10 seconds *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. ultrafast rectifier 5.0 amperes, 520 volts marking diagrams http://onsemi.com axial lead case 267 style 1 4 1 3 dpak case 369c style 8 1 2 3 4 ayww u 550g pin 1: no connect 1 3 4 to ? 220ac case 221b style 1 3 4 1 a = assembly location yy, y = year ww = work week or g = pb ? free package ka = diode polarity (note: microdot may be in either location) ay wwg mur550pf ka a mur 550apf yyww aywwg murf550pf ka to ? 220fp case 221e style 1 3 4 1 1 3 4
mur550apfg, MURD550PFG, mur550pfg, murf550pfg, nrvud550pft4g http://onsemi.com 2 ordering information device package shipping ? mur550apfg axial 500 units/bag mur550apfrlg axial 1,500 tape & reel murd550pft4g dpak (pb ? free) 2,500 tape & reel nrvud550pft4g dpak (pb ? free) 2,500 tape & reel mur550pfg to ? 220ac (pb ? free) 50 units/rail murf550pfg to ? 220fp (pb ? free) 50 units / rail ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 520 v average rectified forward current (rated v r ) t c = 65 ? c mur550apfg (rated v r ) t c = 160 ? c MURD550PFG, nrvud550pft4g, mur550pfg, murf550pfg i f(av) 5.0 5.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, 60 hz) mur550apfg nrvud550pft4g, MURD550PFG mur550pfg, murf550pfg i fsm 85 75 100 a operating junction temperature range t j ? 65 to +175 ? c storage temperature range t stg ? 65 to +175 ? c esd ratings: machine model = c human body model = 3b esd > 400 > 8000 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? case (note 1) murd550pg, mur550pfg, nrvud550pft4g murf550pfg r jc 2.8 5.75 ? c/w thermal resistance, junction ? to ? ambient mur550apfg nrvud550pft4g, MURD550PFG (note 3), murf550pfg r ja note 2 62 75 ? c/w 1. rating applies when surface mounted on the minimum pad sizes recommended. 2. see note 2, ambient mounting data. 3. 1 inch square pad size on fr4 board. electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage drop (note 4) (i f = 5.0 a, t j = 25 ? c) (i f = 5.0 a, t j = 150 ? c) v f 1.15 0.98 v maximum instantaneous reverse current (note 4) (v r = 520 v, t j = 25 ? c) (v r = 520 v, t j = 150 ? c) i r 5.0 400 a maximum reverse recovery time (i f = 1.0 a, di/dt = 50 a/ s, v r = 30 v, t j = 25 ? c) t rr 95 ns 4. pulse test: pulse width = 300 s, duty cycle ? 2.0%.
mur550apfg, MURD550PFG, mur550pfg, murf550pfg, nrvud550pft4g http://onsemi.com 3 lead length, l (in) mounting method 1/8 1/4 1/2 units 1 2 3 50 58 r ja 51 53 59 61 28 ? c/w ? c/w ? c/w typical values for r ja in still air data shown for thermal resistance junction ? to ? ambient (r ja ) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. note 2 ? ambient mounting data mounting method 1 mounting method 2 mounting method 3 3/4 55 63 l l p.c. board where available copper surface area is small. ? in terminals t ? 28 ? p.c. board with 1 ? 1/2 ? x1 ? 1/2 ? copper surface
mur550apfg, MURD550PFG, mur550pfg, murf550pfg, nrvud550pft4g http://onsemi.com 4 i r , reverse current (amps) i f , instantaneous forward current (amps) figure 1. typical forward voltage figure 2. maximum forward voltage figure 3. typical reverse current figure 4. maximum reverse current 0 v f , instantaneous forward voltage (volts) 10 1.0 500 0 v r , reverse voltage (volts) 1.0e ? 3 1.0e ? 4 1.0e ? 6 1.0e ? 7 1.0e ? 9 0.1 1.2 0.4 0.8 1.6 100 200 300 125 ? c 150 ? c 25 ? c 125 ? c 25 ? c 0.2 1.4 0.6 1.0 100 1.0e ? 5 1.0e ? 8 400 150 ? c i f , instantaneous forward current (amps) v f , maximum instantaneous forward voltage (volts) 0 10 1.0 0.1 1.2 0.4 0.8 1.6 125 ? c 150 ? c 25 ? c 0.2 1.4 0.6 1.0 100 i r , maximum reverse current (amps) 500 0 v r , reverse voltage (volts) 1.0e ? 3 1.0e ? 4 1.0e ? 6 1.0e ? 7 1.0e ? 9 100 200 300 125 ? c 25 ? c 1.0e ? 5 1.0e ? 8 400 150 ? c p fo , average power dissipation (watts) i f , average forward current (amps) figure 5. current derating figure 6. forward power dissipation 120 150 100 t c , case temperature ( ? c) 10 5 0 i o , average forward current (amps) 1 0 7 6 5 3 1 0 5 130 170 160 2 4 6 10 4 180 square wave dc square wave dc 37 2 110 140 89 10 9 8
mur550apfg, MURD550PFG, mur550pfg, murf550pfg, nrvud550pft4g http://onsemi.com 5 c, capacitance (pf) figure 7. capacitance 0 v r , reverse voltage (volts) 100 10 1 150 50 100 25 ? c 200 r (t) , transient thermal resistance figure 8. thermal response for mur550apfg 1000 0.1 0.000001 t, time (s) 100 1 0.1 0.0001 0.001 0.01 1.0 10 0.01 single pulse 0.5 0.2 0.1 0.05 0.01 0.00001 100 p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 10 r (t) , transient thermal resistance figure 9. thermal response for MURD550PFG, nrvud550pft4g 1000 0.1 0.000001 t, time (s) 10 1 0.1 0.0001 0.001 0.01 1.0 10 0.01 single pulse 0.5 0.2 0.1 0.05 0.01 0.00001 100 p (pk) t 1 t 2 duty cycle, d = t 1 /t 2
mur550apfg, MURD550PFG, mur550pfg, murf550pfg, nrvud550pft4g http://onsemi.com 6 r (t) , transient thermal resistance figure 10. thermal response for mur550pfg 1000 0.1 0.000001 t, time (s) 10 1 0.1 0.0001 0.001 0.01 1.0 10 0.01 single pulse 0.5 0.2 0.1 0.05 0.01 0.00001 100 p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 figure 11. thermal response, (murf550pfg) junction ? to ? case (r jc ) t, time (s) 0.1 10 0.001 1.0 10 100 1000 0.1 0.000001 z jc (t) = r(t) r jc r jc = 1.6 ? c/w max d curves apply for power pulse train shown read time at t 1 t j(pk) - t c = p (pk) z jc (t) p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 d = 0.5 0.1 0.05 0.01 single pulse 0.2 0.02 1.0 0.01 0.01 0.001 0.0001 0.00001 r(t), transient thermal response (normalized) ( ? c/w) figure 12. thermal response, (murf550pfg) junction ? to ? ambient (r ja ) t, time (s) 0.1 100 0.001 1.0 10 100 1000 0.1 0.000001 z jc (t) = r(t) r jc r jc = 1.6 ? c/w max d curves apply for power pulse train shown read time at t 1 t j(pk) - t c = p (pk) z jc (t) p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 d = 0.5 0.1 0.05 0.01 single pulse 0.2 0.02 1.0 0.01 0.01 0.001 0.0001 0.00001 r(t), transient thermal response (normalized) ( ? c/w) 10
mur550apfg, MURD550PFG, mur550pfg, murf550pfg, nrvud550pft4g http://onsemi.com 7 package dimensions axial lead case 267 ? 05 issue g style 1: pin 1. cathode (polarity band) 2. anode 1 2 k a k d b dim min max min max millimeters inches a 0.287 0.374 7.30 9.50 b 0.189 0.209 4.80 5.30 d 0.047 0.051 1.20 1.30 k 1.000 --- 25.40 --- notes: 1. dimensions and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 267-04 obsolete, new standard 267-05. dpak (single gauge) case 369c ? 01 issue d b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw
mur550apfg, MURD550PFG, mur550pfg, murf550pfg, nrvud550pft4g http://onsemi.com 8 package dimensions to ? 220 two ? lead case 221b ? 04 issue e b r j d g l h q t u a k c s 4 13 dim min max min max millimeters inches a 0.595 0.620 15.11 15.75 b 0.380 0.405 9.65 10.29 c 0.160 0.190 4.06 4.82 d 0.025 0.035 0.64 0.89 f 0.142 0.161 3.61 4.09 g 0.190 0.210 4.83 5.33 h 0.110 0.130 2.79 3.30 j 0.014 0.025 0.36 0.64 k 0.500 0.562 12.70 14.27 l 0.045 0.060 1.14 1.52 q 0.100 0.120 2.54 3.04 r 0.080 0.110 2.04 2.79 s 0.045 0.055 1.14 1.39 t 0.235 0.255 5.97 6.48 u 0.000 0.050 0.000 1.27 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. f style 1: pin 1. cathode 2. n/a 3. anode 4. cathode to ? 220 fullpak, 2 ? lead case 221e ? 01 issue a ? b ? ? y ? seating plane ? t ? r c s u j a f q h k g n l d 2 pl m b m 0.25 (0.010) y notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. dim min max min max millimeters inches a 0.617 0.633 15.67 16.07 b 0.392 0.408 9.96 10.36 c 0.177 0.193 4.50 4.90 d 0.024 0.039 0.60 1.00 f 0.121 0.129 3.08 3.28 g h 0.117 0.133 2.98 3.38 j 0.018 0.025 0.45 0.64 k 0.499 0.562 12.68 14.27 l 0.045 0.060 1.14 1.52 n q 0.122 0.138 3.10 3.50 r 0.101 0.117 2.56 2.96 s 0.092 0.108 2.34 2.74 u 0.255 0.271 6.48 6.88 style 1: pin 1. cathode 2. n/a 3. anode 123 0.100 bsc 0.200 bsc 2.54 bsc 5.08 bsc on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mur550/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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